Power Module

The core building block inside the power stack.

What’s actually different:

Dual-side cooling.

Non-isolated T0247-like design.

No wire bonding except for the gate connection.

Any die supplier – IGBT or SiC.

What that leads to:

  • Low inductance <1nH.
  • Low Rth ~ 0.02 K/W.
  • Supply resilient.